This privately held semiconductor startup is developing ultra-low-power, high-density optical interconnect technology designed to overcome critical connectivity challenges in AI infrastructure. Founded by experienced optical networking technologists, the company is advancing microLED-based communications for semiconductor, data center, and high-performance computing applications. Its work offers an opportunity to help shape breakthrough technology within a focused, fast-moving team.

This role will develop and test packaging solutions for multi-lane optical interconnects. The engineer will work across optical sub-assemblies, multi-fiber connectors, micro-array assembly processes, optomechanical testing, and component qualification. It is a hands-on opportunity to solve complex packaging challenges and collaborate with external vendors on next-generation optical connectivity.

Responsibilities:

Design and test optical sub-assemblies with arrays of optical fibers.

Design multi-fiber optical connectors and work with external vendors to develop the connector ecosystem.

Design micro-array assembly processes, fixtures, and tooling.

Work with optical fibers, optical launch optimization, and optical loss testing.

Develop mechanical/optomechanical test procedures.

Perform micron-level assembly techniques.

Measure material properties and interactions (e.g., epoxy selection, CTE, stress).

Perform component reliability and qualification testing.

Required Experience:

5+ years’ experience in the optomechanical or optical packaging field.

M.S. degree or higher in Optomechanical Engineering, Physics, or an equivalent field.

Hands-on expertise with mechanical design software (e.g., SolidWorks) and mechanical modeling simulations.

Ability to work independently in a fast-paced startup environment.

Excellent teamwork and interpersonal/communication skills within the company and with partners, customers, and consultants.

Preferred Experience:

Experience with optical transceiver assembly, silicon photonics, or co-packaged optics.

Nice-to-Have:

Experience with optical modeling software (e.g., Zemax, LightTools) is an asset.

Knowledge of micro-replication techniques and polymer molding is an asset.

To Learn More:

503-388-9585

833-NAU-WORK

careers.nauwork.com

Category: Engineering - Electrical (Semiconductor)

Position: Optical Packaging/Component Engineer

Location: Sunnyvale, California

Job Type: Direct-Hire, Full-Time