Mechanical Engineer 2

Overview We are seeking a full-time Mechanical Engineer 2 in the Santa Barbara area. In this role, you will be responsible for developing mechanical solutions for semiconductor packaging and electronics systems. Perform testing and validation, explore emerging technologies, and support the transition of new designs from development through mass production. Essential Functions Complete moderately complex mechanical designs for semiconductor packaging and high-precision electronics products. Own semiconductor packaging and assembly processes from concept through mass production, including die attach, wire bonding, hermetic sealing and related manufacturing processes. Serve as an expert CAD user, developing complex 3D mechanical designs and performing finite element analysis (FEA) to simulate structural, modal, thermal, and other relevant mechanical physics. Collaborate and add value through participation in design reviews, providing comments and suggestions on mechanical engineering designs Work closely with electrical, mechanical, manufacturing, and program teams to deliver practical, manufacturable designs. Support product development from concept through qualification and production release Make estimates on tooling, part cost and design time for basic mechanical designs Communicate effectively with vendors that produce custom mechanical parts as required Possess knowledge of injection modeling, die casting, sheet metal stamping, machining processes, etc. Demonstrate proficient knowledge of preferred part materials for basic part production and performance Basic Qualifications Bachelor’s Degree in Mechanical Engineering, Manufacturing Engineering or Aerospace Engineering AND 1 year relevant experience OR an equivalent combination of education and experience Excellent academics (cumulative GPA greater than or equal to 3.0 as a general rule) Demonstrates knowledge of CAD software and the ability to model moderately complex parts Demonstrates proficient knowledge and utilization of relevant engineering tools Desired Qualifications Outstanding academics (cumulative GPA greater than or equal to 3.5) Previous work or internship experience in design, particularly for semiconductor packaging products Mechanical systems repair or troubleshooting experience Experience using SolidWorks CAD software and COMSOL simulation software Garmin International is an equal opportunity employer. Qualified applicants will receive consideration for employment without regard to race, religion, color, national origin, citizenship, sex, sexual orientation, gender identity, veteran’s status, age or disability. This position is eligible for Garmin's benefit program. Details can be found here: Garmin Benefits Essential Functions Complete moderately complex mechanical designs for semiconductor packaging and high-precision electronics products. Own semiconductor packaging and assembly processes from concept through mass production, including die attach, wire bonding, hermetic sealing and related manufacturing processes. Serve as an expert CAD user, developing complex 3D mechanical designs and performing finite element analysis (FEA) to simulate structural, modal, thermal, and other relevant mechanical physics. Collaborate and add value through participation in design reviews, providing comments and suggestions on mechanical engineering designs Work closely with electrical, mechanical, manufacturing, and program teams to deliver practical, manufacturable designs. Support product development from concept through qualification and production release Make estimates on tooling, part cost and design time for basic mechanical designs Communicate effectively with vendors that produce custom mechanical parts as required Possess knowledge of injection modeling, die casting, sheet metal stamping, machining processes, etc. Demonstrate proficient knowledge of preferred part materials for basic part production and performance Basic Qualifications Bachelor’s Degree in Mechanical Engineering, Manufacturing Engineering or Aerospace Engineering AND 1 year relevant experience OR an equivalent combination of education and experience Excellent academics (cumulative GPA greater than or equal to 3.0 as a general rule) Demonstrates knowledge of CAD software and the ability to model moderately complex parts Demonstrates proficient knowledge and utilization of relevant engineering tools Desired Qualifications Outstanding academics (cumulative GPA greater than or equal to 3.5) Previous work or internship experience in design, particularly for semiconductor packaging products Mechanical systems repair or troubleshooting experience Experience using SolidWorks CAD software and COMSOL simulation software Garmin International is an equal opportunity employer. Qualified applicants will receive consideration for employment without regard to race, religion, color, national origin, citizenship, sex, sexual orientation, gender identity, veteran’s status, age or disability. This position is eligible for Garmin's benefit program. Details can be found here: Garmin Benefits